2024 @ Osaka

5th ISBENS @Osaka, 7/4-6, 2024
International Symposium on Engineering and Technology Innovation


2024 International Symposium on Engineering and Technology Innovation, under the theme "Artificial Intelligence (AI) and Machine Learning," emerges as a pivotal nexus for researchers, engineers, and innovators navigating the cutting-edge landscapes of technology and intelligent systems. In an era defined by the pervasive influence of artificial intelligence and machine learning, this symposium serves as a dynamic arena for exploration and collaboration. The symposium is uniquely positioned to delve into the latest breakthroughs, challenges, and transformative applications, fostering a collective understanding of how the convergence of engineering and technology innovation is propelling the frontiers of AI and machine learning to unprecedented heights.


Local Host

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Professor Hitoshi Sasaki

Takushoku University
Introduction
Professor Sasaki's expertise lies in the realm of educational technology, where his current research endeavors are focused. With a wealth of experience spanning approximately 15 years, he has been actively involved in the IEEE Education Society Japan Chapter across various sections, including Tokyo, Shin-Etsu, Nagoya, Sendai, Kansai, Sapporo, Shikoku, Fukuoka, and Hiroshima. Notably, Professor Sasaki served as the chair of the chapter from 2012 to 2015, demonstrating his leadership and dedication to advancing the field.
In recognition of his outstanding contributions, Professor Sasaki was honored with the Chapter Achievement Award from the IEEE Education Society in 2017. Moreover, he holds the esteemed status of a senior member of IEICE (the Institute of Electronics, Information, and Communication Engineers).
In addition to his affiliations with IEICE, Professor Sasaki is a member of several esteemed societies, including IPSJ (Information Processing Society of Japan), JSET (the Japan Society for Educational Technology), and JSISE (the Japanese Society for Information and Systems in Education).
Welcome Message
Dear guests and participants,
I am pleased to welcome you to the Higher Education Forum Conference in Osaka, a city brimming with vitality in preparation for the 2025 Japan International Exposition!
Located in the heart of the Kinki region, Osaka has historically developed as a merchant town and is known for its rich history, innovative spirit, and warm hospitality.
This Osaka is also called "the kitchen of the nation." Various mouth-watering dishes, from cheap but delicious local delicacies such as takoyaki and okonomiyaki to fugu nabe ("Tetchiri Nabe”), will take you on a culinary adventure. During your stay, please enjoy Osaka's gastronomic delights to the fullest.
Osaka is also known as the "City of Laughter" for its vibrant and influential comedy ("Owarai") culture. Osaka has a unique form of entertainment known as "Manzai." It is characterized by rapid-fire conversation between a "Boke" (funny person) and a "Tsukkomi" (serious person).
Although you may find listening to rapid-fire conversations conducted in Japanese difficult, laughter is universal. The reactions that unfold at a light tempo will surely make you smile.
Osaka also has a rich cultural heritage, as represented by Osaka Castle, and there is no shortage of experiences to entertain and inspire you.
I hope you will not only experience the latest advances and insights in your fields but also take the time to immerse yourself in the essence of Osaka: its warmth, vibrancy, and spirit of innovation.
Once again, a warm welcome to Osaka, where tradition and innovation merge, and every moment is an adventure.
I wish you a fruitful and memorable international conference!


Keynote Speaker

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Prof. Li, Kun Chung

Topic: Teaching Strategies to Cope with the Impact of Generative AI


Keynote Speaker

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Prof. Vilas G. Pol

Topic: Innovative Benign Quasi-Solid-State and Ultralow Temperature (<-100oC) Li-ion Batteries



Biography

Vilas G. Pol is a Professor of Chemical Engineering at Purdue University, IN, USA. He authored/co-authored >270 research publications (h index 58), an inventor on 20 issued US patents and 17+ applications. He delivered hundreds of invited, keynote and plenary talks including ‘TEDx’. Purdue University honored him with Outstanding Engineering Teachers, Most Impactful Inventors, Seed for Success, Bravo, and Purdue Faculty Scholar awards. He is honored with 35+ prestigious awards from professional AIChE, ACS, MRS, ACerS, TMS and Carbon societies. He also received 2015 R and D 100 award as well as two Guinness World RecordsTM. He is a fellow of Royal Society of Chemistry (FRSC).


Venue
Osaka International Convention Center
Address:
5-3-51, Nakanoshima Kita-ku, Osaka 530-0005 JAPAN
Telephone number:06-4803-5555


Member Center
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Important Dates
Submission Deadline
May 01 / 2024Still Open
Notification of Acceptance
March 18/ 2024
Early Bird Registration Deadline
April 15/ 2024
Registration Deadline
May 31/ 2024
Conference Dates
July 04 - 06, 2024
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